Saturday, March 20, 2021

Physical Design for 3D Integrated Circuits Edited By Aida Todri-Sanial, Chuan Seng Tan and Krzysztof Iniewski

 Physical Design for 3D Integrated Circuits Edited By Aida Todri-Sanial, Chuan Seng Tan and Krzysztof Iniewski


Contents of Physical Design for 3D Integrated Circuits Books :

Chapter 1 2.5D/3D ICs: Drivers, Technology, Applications, and Outlook
Chapter 2 Overview of Physical Design Issues for 3D-Integrated Circuits
Chapter 3 Detailed Electrical and Reliability Study of Tapered TSVs
Chapter 4 3D Interconnect Extraction
Chapter 5 3D Placement and Routing
Chapter 6 Power and Signal Integrity Challenges in 3D Systems-on-Chip
Chapter 7 Design Methodology for TSV-Based 3D Clock Networks
Chapter 8 Design Methodology for 3D Power Delivery Networks
Chapter 9 Live Free or Die Hard: Design for Reliability in 3D Integrated Circuits
Chapter 10 Thermal Modeling and Management for 3D Stacked Systems
Chapter 11 Exploration of the Thermal Design Space in 3D Integrated Circuits
Chapter 12 Dynamic Thermal Optimization for 3D Many-Core Systems
Chapter 13 TSV-to-Device Noise Analysis and Mitigation Techniques
Chapter 14 Overview of 3D CAD Design Tools
Chapter 15 Design Challenges and Solutions for Monolithic 3D ICs
Chapter 16 Design of High-Speed Interconnects for 3D/2.5D ICs without TSVs
Chapter 17 Challenges and Future Directions of 3D Physical Design

Preface of Physical Design for 3D Integrated Circuits Book

Three-dimensional (3D) stacking and 2.5D interposer side-by-side integration are very attractive
contenders as we head toward an incommensurate return of interconnects and packaging technology. As demand for on-chip functionalities and requirements for low power operation continue to
increase as a result of the emergence of mobile, wearable, and Internet of Things products, 3D/2.5D
integration has been identified as inevitable in moving forward. The advent of 3D/2.5D integration
is a direct result of active research in academia, research laboratories, and industry over the past
decade. Today, 3D/2.5D integration takes many forms, depending on the applications. At the time
of this writing, there are already commercial products driven by the needs for form factor and
density.

As a direct result of many years of active research, there is substantial documentation on 3D/2.5D
technology. A book dedicated to the physical design for 3D integrated circuits (ICs), however, is
lacking. The idea for a book on physical design for 3D ICs dates back more than a year ago. While
the initial idea was to write a book, we soon realized that such an endeavor would be extremely challenging given the various expertises in this field. We revisited the plan and decided to edit a book
instead, with contributions from experts in academia, research laboratories, and industry. After
careful planning, we identified and invited contributions from an impressive lineup of highly qualified researchers. The task took a full year from planning, writing, editing, and printing.
This book aims to unveil how to effectively and optimally design such 3D circuits. It also presents the design tools for 3D circuits, while exploiting the benefits of 3D technology. Initially, an
overview of physical design challenges with respect to conventional 2D circuits is provided, and
then each chapter is dedicated to provide an in-depth look into each physical design topic. Physical
Design for 3D Integrated Circuits is the first book to analyze the design tools for 3D ICs covering
all design aspects and explaining the challenges and solutions unique for 3D circuits. This book is
particularly beneficial to researchers and engineers who are already working or are beginning to
work on 3D technology.

This book would not have been possible without a team of highly qualified and dedicated people. We are particularly grateful to Kris Iniewski for initiating this undertaking and for his encouragement. Nora Konopka and Jessica Vakili worked alongside us and provided us with the necessary editorial support. Aida Todri-Sanial is grateful for the continued support for her work on 3D integration from the French National Research Agency (ANR) and strong collaborations with CEA-LETI, France. Chuan Seng Tan is grateful for the continued support for his work on 3D integration in Singapore from the Ministry of Defense (MINDEF), the Ministry of Education (MOE), the Agency for Science, Technology and Research (A*STAR), and the National Research Foundation (NRF). This book would not have been possible without this extended research support. Last but not least, we are extremely thankful to the authors who accepted our invitation and contributed chapters to this book.

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